Optoelectronic module

ABSTRACT

An optoelectronic module including a transparent substrate that carries a conductor track, an optoelectronic chip having an optoelectronic sensor and/or emitter for light disposed on the substrate, and via a contacting element the chip is connected to the conductor track and kept spaced apart from the transparent substrate. An opaque light blocking element, disposed between the substrate and the chip, that shields the sensor from lateral incident light and/or lateral light opposite the emitter.

Applicants claim, under 35 U.S.C. §119, the benefit of priority of thefiling date of Mar. 25, 1998 of a German patent application, copyattached, Ser. No. 298 05 392.6, filed on the aforementioned date, theentire contents of which is incorporated herein by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The invention relates to an optoelectronic module, which can be employedin particular in optoelectronic travel, angle and rotational measuringinstruments or other optoelectronic devices.

2. Description of the Related Art

In the journal “F&M”, No. 10 (1996), Vol. 104, pages 752-756, anemitter-receiver module is disclosed. An LED is disposed on a photodiodearray chip, which is connected via gold bumps to conductor tracks on atransparent glass plate in what is known as flip-chip technology. Theintermediate space between the chip and the glass substrate is filledwith an underfiller for the sake of mechanical stabilization. Thisarrangement is intended to project light onto a scale by means of theLED and to detect the reflected light by the photodiodes. It isdisadvantageous, however, that the underfiller is a very good lightguide, which guides a large portion of the light in the underfiller,which has been projected by the LED, to the photodiodes. Portions of thelight are diverted to the photodiodes by scattering in the underfillerand reflection at the boundary faces of the underfiller and the glasssubstrate, and further portions are projected directly at the edges ofthe LED onto the receiver surfaces of the optic chip. As a consequence,the proportion of useful light to parasitic or unwanted light strikingthe photodiodes is unfavorable.

From German Patent Disclosure DE 197 20 300 A, a chip- in-chipimplantation of a gallium arsenide LED chip in a silicon-PIN-diodereceiver matrix is known. Once again, there can be a considerableproportion of scattered light, which strikes the diode receiver matrixdirectly without taking the desired course, for instance to a scalehaving an optical graduation. As a result, on the one hand the usefulsignal proportion is reduced considerably, and on the other thephotodiodes are already modulated with a considerable proportion ofdirect light. In such flip-chip assemblies, it is also conventional andfor applications indispensable, for the sake of mechanical stability andsurface passivation, that an optical underfiller be placed between thechip surfaces and the glass substrate plate. The underfiller doesprovide high mechanical strength and chemical resistance, but it causesan even larger proportion of light to be coupled directly to thephotodiode surfaces. Once again, the optoelectronic efficiency ismarkedly worse as a result.

SUMMARY OF THE INVENTION

With this as the point of departure, an object and advantage of thepresent invention is to create an optoelectronic module in which theproportion of useful light to parasitic or unwanted light is improved.

The above object and advantage is attained by an optoelectronic moduleincluding a transparent substrate that carries a conductor track, anoptoelectronic chip having an optoelectronic sensor and/or emitter forlight disposed on the substrate and via a contacting element the chip isconnected to the conductor track and kept spaced apart from thetransparent substrate. An opaque light blocking element, disposedbetween the substrate and the chip, that shields the sensor from lateralincident light and/or lateral light opposite the emitter.

The optoelectronic module of the present invention has a transparentsubstrate that carries conductor tracks. This substrate may be inplatelike form. Glass and/or plastic can be considered in particular asthe material for the substrate.

An optoelectronic chip with at least one sensor and/or emitter for lightis also present, which is disposed with the sensor and/or emitteroriented toward the substrate on the substrate. The sensor and/oremitter can be embodied in one face of the chip. However, it can also bean additional component that is mounted on the chip.

The chip is connected to the conductor tracks and kept at a distancefrom the transparent substrate via contacting elements. The contactingelements serve the purpose of both mechanical and electrical connectionof the chip to the substrate or to the conductor tracks disposed on it.Gold bumps or similar contacting elements can be considered inparticular as the contacting elements. The known flip-chip technologycan be employed.

In the optoelectronic module, an underfiller is preferably disposedbetween the chip and the transparent substrate. The underfiller can betransparent, especially if it covers an optoelectronic sensor and/oremitter. The underfiller may involve an epoxy resin, silicone, or asimilar hardening plastic material. An underfiller is indeed preferredbut is not obligatory.

Finally, in the intermediate space between the chip and the transparentsubstrate, an opaque light blocking element is disposed, which more orless shields off the sensor from lateral incident light and/or laterallight projected by the emitter. Lateral denotes means an incidence oflight or projection of light from or in a direction that is inclined toa vertical axis or line through the chip. This means, for instance, anincident light that does not originate directly at a specific externalobject but instead is due to scattering or reflection, or it can also bedirect radiation from some other object. This parasitic or unwantedlight can also originate in a light emitter integrated with the module.It can also be a light projection that is not aimed directly at adifferent object. As a consequence, in the module of the presentinvention, the proportion of parasitic or unwanted light striking thesensor or transmitted by the emitter is at least reduced considerably,and on the other hand, the proportion of useful light is increased.

The present invention also encompasses an only partial suppression ofparasitic or unwanted light by the light blocking element. It is alsowithin the scope of the present invention that the light blockingelement is not ideally opaque, and the substrate and optionally theunderfiller are not ideally transparent. Within the scope of the presentinvention, an opacity or transparency may exist with regard to onlycertain light wavelengths or light length ranges of a light source withwhich the optoelectronic module cooperates. The decisive factor is thata considerable suppression of parasitic or unwanted light in favor ofthe useful light is attained for at least a certain light wavelength.

The module may be purely a receiver module that cooperates with anexternal artificial or natural light source. In that case, the lightblocking element especially suppresses the interfering influence ofscattered and extraneous light. However, it can also be purely anemitter module that especially effectively transmits light to someexternal object. It can also be an emitter-receiver module, in which anemitter is disposed on the chip, and the light blocking element isdisposed between the emitter and the sensor. The emitter can inparticular be an LED. The light blocking element prevents both opticalcrosstalk from the emitter to the sensor and the incidence of extraneouslight onto the sensor.

Especially if underfillers or some similar optically transparent pottingcompound is employed, the parasitic or unwanted light due to scatteringand reflection is minimized in the module, and thermomechanical stressesin the overall structure can also be kept very low. Such stresses can bedue in particular to the different coefficients of thermal expansion ofthe materials. To adapt the coefficients of expansion toward that ofgold bumps, underfillers are often filled with finely ground quartz, butthis in turn increases the proportion of scattered light. The presentinvention makes it easier to use such underfillers and ,thus, to reducethermomechanical stresses.

The light blocking element is preferably of a conformable material thatconforms to the chip and/or to the transparent substrate. Thiscounteracts a passage of light between the light blocking element andthe chip or substrate. For production reasons, however, the lightblocking element can be solidly joined to the chip and/or thetransparent substrate for this purpose. Thus, the light blocking elementcan include a commercially available silicone rubber or some otherinjection moldable material. For economic production, this material canalready be applied to the wafer of the chip with a dispenser before thewafer is sawn apart. Another economical method uses a printablematerial, which is applied as a light blocking element by screenprinting, for instance. In this way, light blocking elements can also beprinted on in the wafer grouping. Naturally, it is also conceivable toapply the light blocking element to the transparent substrate and thento mount the chip.

The light blocking element is preferably elastically deformable. To thatend, it can comprise silicone or some other elastically deformablematerial. It can be disposed, elastically prestressed, between thetransparent substrate and the chip. The elastic light blocking elementis capable of compensating for tolerances in the spacing between thetransparent substrate and the optoelectronic chip that are due inparticular to the technology of the connecting elements. In gold bumps,for instance, differences in spacing of approximately 20% are entirelynormal. The elasticity assures a good lightproof contact with both thetransparent substrate and the chip that prevents a passage of parasiticor unwanted light through them.

Precisely in the case of an elastic light blocking element, the bondingwires and/or leads needed can be passed between contacting faces of thelight blocking element on the chip and/or on the transparent substrate.These bonding wires and/or conductor tracks can lead to an emitterand/or to a sensor. The bonding wires of an emitter can, however, alsobe passed through the light blocking element. The elastic light blockingelement can also compensate for tolerances in the amount of underfilleremployed, if the underfiller is positively displaced laterally in thebonding of the chip and the substrate.

The light blocking element can have various shapes. The suppression ofparasitic or unwanted light is especially advantageous if the lightblocking element surrounds the sensor and/or the emitter. In the case ofan emitter-receiver module with a central light emitter and sensorsdistributed around it, for instance, the light blocking element can bedisposed around the emitter. Especially in this case, it can becircular-annular in shape. It can also be embodied in matrix form inaccordance with the disposition of a plurality of sensors on one chipand can surround a plurality of sensors.

The light blocking element can be; manufactured as a micromolded part.It can have specially designed channels that enable the underfiller tobe introduced after the chip has been mounted on the substrate. Speciallaminations disposed in meandering fashion in the channels allow theunderfiller to flow through, on the hand, and on the other they assuremaximum lightproofness.

The inside face of the light blocking element can also be embodied suchthat it contributes to a better light yield from the light source. Tothat end, it can have a spherical, a spherical or planar form. As aresult, an otherwise ineffective edge radiation from an LED can beutilized by targeted reflection from the inside face of the lightblocking element.

The module can be used in particular in an optoelectronic instrument formeasuring travel, angle or rotation. To that end, the emitter can bedisposed either on the module or outside the module. The transparentsubstrate can then have a scanning grating for scanning of a scale.

The invention will be described in further detail below in terms ofexemplary embodiments.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic longitudinal section through a first embodiment ofa emitter-receiver module and an optical position measuring instrument;according to the present invention

FIG. 2, in an enlarged detail of FIG. 1, shows the development of theemitter-receiver module and optical position measuring instrument of,scattered light in the underfiller;

FIG. 3 is a schematic longitudinal section of a first embodiment of alight blocking element embodied as a molded part; according to thepresent invention

FIG. 4 is a schematic longitudinal section through a second embodimentof a emitter-receiver module with the light blocking element of FIG. 3and a depth-structured chip; according to the present invention

FIG. 5 is a detail of a third embodiment of a emitter-receiver modulewith a further light blocking element; according to the presentinvention

FIG. 6 is a detail of a fourth embodiment of a module according to thepresent invention;

FIG. 7 is a detail of a fifth embodiment of a module according to thepresent invention;

FIG. 8 is a detail of a sixth embodiment of a module according to thepresent invention;

FIG. 9 is a detail of a seventh embodiment of a module according to thepresent invention; and

FIG. 10 is a schematic longitudinal section through an eighth embodimentof a module according to the present invention; in an angle measuringinstrument operating by the transmitted light principle according to thepresent invention.

DESCRIPTION OF THE PREFERRED EMBODIMENT

Elements in the various exemplary embodiments that match one another areidentified by the same reference numerals in the ensuing description. Inthis sense, the description has validity for all the exemplaryembodiments involved. When the terms “top” and “bottom” are used, theypertain how the elements are disposed in the drawings.

In FIG. 1, an emitter-receiver module 1 has a transparent substrate 2,which in this example is platelike and is of glass. On its surface, ithas conductor tracks 3, 4. On the underside, it is provided with amatrix structure 5—also known as a scanning grating—including asuccession of transparent and opaque regions each of constant length,which by way of example can be printed on or scratched in.

A chip 6 (semiconductor substrate) is disposed on the upper side of thesubstrate 2 and is fixed via gold bumps 7, 8 to the conductor tracks 3,4 of the substrate 2 and electrically conductively joined to them. Onthe side toward the substrate 2, the chip 6 has a plurality of sensorsurfaces 9, 10, which belong to integrated optoelectronic sensors.

Also on the side of the chip 6 toward the substrate 2, an optoelectronicemitter 11 is provided. It is located in the center of the chip 6between the sensors 9, 10. In this example, it is a gallium arsenidelight emitting diode 1 1 which is mounted in an indentation 12 in theunderside of the chip and is contacted via bonding wires 13, 14 toconductor tracks on the underside of the chip 6.

For passivation and to improve the mechanical stability, an underfiller16 is disposed in this flip-chip structure in the intermediate spacebetween the substrate 2 and the chip 6. The underfiller is transparentat least for the wavelength or wavelength range of the light transmittedby the emitter 11 and received by the sensors 9, 10. Such underfillers16 as a rule include hardening plastic material, such as epoxy resin orsilicone, which has a coefficient of thermal expansion that leads tostrains in the emitter-receiver module 1. To adapt this coefficient ofexpansion to that of the gold bumps 7, 8, the underfiller 16 can befilled with quartz powder or quartz beads 17, as shown in FIG. 2. FIG. 2also shows that of the light 18 projected by the LED 11, only a portion18.1 (useful portion) directly passes through the transparent substrate2 to reach the sensors 9, 10. Another portion is projected as edgeradiation 18.2 directly from the side of the LED 11. A further portion18.3 is reflected once or multiple times by the quartz particles 17.There are also portions 18.4 and 18.5 that are reflected from thesurfaces of the substrate 2.

To keep the parasitic or unwanted light 18.2-18.5 in the underfiller 16away from the sensor surfaces 9, 10, an annular, opaque light blockingelement 19 is disposed between the chip 6 and the substrate 2 in FIG. 1.This light blocking element 19 can in particular include commerciallyavailable silicone rubber. For the sake of economical production, thelight blocking element 19 can already be applied with a dispenser to awafer that has not yet been sawn apart and that includes the chip 6.Another economical method for applying the light blocking element 19that can be considered is screen printing. By it, light blockingelements 19 can also be printed on in the wafer grouping. It is alsoconceivable to apply the light blocking element 19 to the substrate 2and then to put the chip 6 in place and fix it.

One advantage of an elastic light blocking element 19 is that it cancompensate for tolerances in the height of the gold bumps 7, 8 and canhave a good lightproof contact with the substrate 2 and the chip 6. Itcan also compensate for tolerances in the quantity of underfiller 16inside and outside the light blocking element 19 that are caused byexpansion. The bonding wires 13, 14 can also be passed through asneeded, without having to provide special openings, since the materialof the elastic light blocking element 19 is positively displaced at thelocations where the bonding wires are.

Thus the light 18.1 emerging from the glass substrate 2 after passingthrough the matrix structure 5 preferentially reaches the sensors 9, 10.To that end, a scale 200 is associated with the underside of theemitter-receiver module 1; it has a surface, oriented parallel to thesubstrate 2, with a reflective matrix structure 20—also known as ameasuring graduation. This structure or division can be applied orprinted on or scratched in in a known manner by lithographic processes.

The light is reflected by the reflecting fields of the scale 200 andpasses through the transparent regions of the scanning grating 5 of thesubstrate 2 to reach the sensors 9, 10. The light 18.1 is at bestreflected weakly by the nonreflective fields of the scale 200, and thesereflections are also kept away from the sensors 9, 10 by associated darkfields of the scanning grating 5 of the substrate 2. As a consequence, avery highly modulated light signal reaches the sensors 9, 10, andparasitic or unwanted light 18.2-18.5 from the emitter 11 is suppressedpractically 15 entirely.

According to FIG. 3, a light blocking element 19 can be embodied as amicromolded part, in particular of elastic material. The element shownis embodied circular- cylindrically on its outer circumference. On theupper side, it has radially extending channels 21, through which anunderfiller 16, even after assembly of the flip chip assembly, can beplaced with the inclusion of this light blocking element 19 in theinterior 22 thereof, and through which bonding wires 13 can also bepassed as needed. The channels 21 can have meandering laminations—notshown in the drawing—that enable the underfiller 16 to flow through butassure maximal lightproofness. The interior 22 can have a speciallydesigned inner surface 23 which is conically shaped in the region. Itcan contribute to the light yield of the emitter 11 by reflecting theotherwise ineffective edge radiation 18.2 or also scattered radiation18.3 inside the underfiller 16 in the direction of the desired lightradiation 18.1.

In FIG. 4, a similar arrangement to FIG. 1 is shown, but its module 1has a light blocking element 19 as in FIG. 3. A light emitting diode 11is also sunk into the indentation 12 of the chip 6 in such a way that asa result the sensors 9, 10 are already shielded from its edge radiation18.2. Thus, it is above all the scattered light components 18.3-18.5that are shielded off by the light guard barrier 19. The bondingwires—not shown—needed for the electrical connection of the LED 11 canbe passed between the light blocking element 19 and the substrate 2.Because of the elasticity of the light blocking element 19, the bondingwires are pressed in lightproof and sealing fashion against thesubstrate 2 or the chip 6.

In FIG. 5, another embodiment of a light blocking element 19 is shown.It includes mutually offset annular ribs 19.1 and 19.2. One of the ribs19.1 is applied as an annular shutter on the chip 6, and the other rib19.2, of somewhat lesser diameter, is applied to the transparentsubstrate. The height of each of the ribs 19.1 and 19.2 is somewhat lessthan the spacing between the chip 6 and the substrate 2. The ribs 19.1,19.2 guarantee extensive lightproofness for the radiation 18.2-18.5, butallow the underfiller 16 to flow through and also as needed allow thebonding wires 13, 14 to be passed through the gap between the ribs 19.1and 19.2. This arrangement has the advantage that the light blockingelement 19 can be manufactured with greater tolerance in terms ofheight, yet nevertheless secure light sealing and forceless bridging ofthe spacing are achieved.

To enable manufacturing the light blocking element 19 with hightolerance in terms of height, it can alternatively include a single rib19, which penetrates an indentation 15 in the chip 6 and/or substrate 2,as shown in FIG. 6.

The light blocking element 19 can also perform the function of stoppingthe flow of underfiller 16. Then the underfiller 16 can be disposed ononly one side of the light blocking element 19. It is advantageous tokeep the space 22 around the emitter 11 free of underfiller 16. This hasthe advantage that no mechanical strains act on the emitter 11, and thatthe interfering radiation 18.3 is eliminated. One example of this isshown in FIG. 7.

To avoid introducing of extraneous light laterally onto the sensors 9,10, an additional light blocking element 24 or 24.1 can be disposed inthe outer region of the chip 6 next to the gold bumps 7, 8. This lightblocking element also reduces the influence of extraneous light that isreflected from the scale 200. As a consequence, these versions have afurther improved ratio of useful light to parasitic or unwanted light.In FIG. 8, this additional light blocking element is an elastic seal 24in the form of an annular shutter and in FIG. 9 it is an encompassingopaque coating 24.1 of the underfiller 16.

FIG. 10 shows a transmitted light arrangement, in which the module 1 ispurely a receiver module. Once again it has a platelike transparentsubstrate 2, which is joined to a chip 6 via gold bumps 7, 8. The chip 6has a photodiode array 9, 9′, 10, (9, 10′ not shown) withlight-sensitive surfaces, which are surrounded by a matrixlike lightblocking element 19. For economical production, the matrixlike lightblocking element 19 can be printed on using a screen printing template.

Between the substrate 2 and the chip 6, an underfiller 16 is locatedinside the openings of the light blocking element 19.

In FIG. 10, a scale in the form of a code disk 200 is associated withthe module 1 on the side of the substrate 2; this disk is rotatableabout an axis 26. In a region through which light can be projected, thedisk has a matrix structure 20 of bright and dark fields through whichlight can be transmitted. On the top of the substrate 2, a correspondingmatrix structure 5—shown only schematically, with four 90° phase-shiftedscanning gratings, one of which is assigned to each of the sensors 9,9′, 10, 10′, is associated with the matrix structure 20.

A light emitting diode 28 is disposed above the code disk 200, and acondenser 29 is disposed between them.

The light emitting diode 28 and the condenser 29 generate a parallelbeam of light 30, which shines through the matrix structure 20 of thecode disk 200. This rotary—position-dependent pattern of light thenstrikes the four 90° phase-shifted scanning gratings 5 of the substrate2. As a consequence, four sinusoidally modulated streams of light arecreated, of each of which a portion again strikes a sensor 9, 9′, 10,10′ of the four-field diode array on the chip 6, which generatescorresponding position-dependent electrical signals. Optical crosstalkbetween the various light signals is prevented by the matrixlike lightblocking element 19.

In a manner not shown, the light blocking element can also be formed bythe contacting elements 7, 8, by lining up individual gold bumps next toeach other, or by placing a solder wire on one face of the substrate 2and/or chip 6. In these embodiments, the light blocking element has adual function, namely light shielding and electrical contacting.

The invention may be embodied in other forms than those specificallydisclosed herein without departing from its spirit or essentialcharacteristics. The described embodiments are to be considered in allrespects only as illustrative and not restrictive, and the scope of theinvention is commensurate with the appended claims rather than theforegoing description.

We claim:
 1. An optoelectronic module, comprising: a transparentsubstrate that carries a conductor track; an optoelectronic chipcomprising a optoelectronic sensor disposed on said substrate, and via acontacting element said chip is connected to said conductor track andkept spaced apart from said transparent substrate; and an opaque lightblocking element, disposed between said substrate and said chip, thatshields said sensor from lateral incident light.
 2. The optoelectronicmodule of claim 1, wherein said light blocking element comprises anelastic conformable material, which conforms to said chip and adapts tothe spacing between said chip and said substrate.
 3. The optoelectronicmodule of claim 1, wherein said light blocking element comprises anelastic conformable material, which conforms to said transparentsubstrate and adapts to the spacing between said chip and saidsubstrate.
 4. The optoelectronic module of claim 1, wherein said lightblocking element is solidly joined to said chip.
 5. The optoelectronicmodule of claim 1, wherein said light blocking element is solidly joinedto said transparent substrate.
 6. The optoelectronic module of claim 1,wherein said light blocking element comprises injection-moldable whichis applied to said chip.
 7. The optoelectronic module of claim 1,wherein said light blocking element comprises injection-moldable whichis applied to said substrate.
 8. The optoelectronic module of claim 1,wherein said light blocking element comprises printable material whichis applied to said chip.
 9. The optoelectronic module of claim 1,wherein said light blocking element comprises printable material whichis applied to said substrate.
 10. The optoelectronic module of claim 1,further comprising an emitter for light.
 11. The optoelectronic moduleof claim 10, wherein said sensor and said emitter are disposed on or insaid chip, and said light blocking element is disposed between saidsensor and said emitter.
 12. The optoelectronic module of claim 11,wherein said sensor and a second sensor are distributed about saidemitter.
 13. The optoelectronic module of claim 1, wherein said lightblocking element surrounds said sensor.
 14. The optoelectronic module ofclaim 13, wherein said light blocking element is embodied incircular-annular form.
 15. The optoelectronic module of claim 1, whereina bonding wire of said sensor is passed through said light blockingelement.
 16. The optoelectronic module of claim 1, further comprising anunderfiller that is disposed in an intermediate space between said chipand said transparent substrate.
 17. The optoelectronic module of claim16, wherein said underfiller is disposed on only one side of said lightblocking element.
 18. The optoelectronic module of claim 1, wherein saidlight blocking element comprises a first rib of said chip and a secondrib of said substrate, wherein said first and second ribs are disposedoffset from one another and overlap in height.
 19. The optoelectronicmodule of claim 1, wherein said light blocking element comprises onlyone rib, and said rib engages an indentation of said substrate.
 20. Theoptoelectronic module of claim 1, wherein said light blocking elementcomprises only one rib, and said rib engages an indentation of saidchip.
 21. The optoelectronic module of claim 1, wherein said transparentsubstrate comprises a plurality of opaque and transparent regionsdisposed in alternation, which form a scanning grating for cooperationwith a measurement graduation of a scale of a position measuring system.22. An optoelectronic module, comprising: a transparent substrate thatcarries a conductor track; an optoelectronic chip comprising a sensorand an emitter for light disposed on said substrate, and via acontacting element said chip is connected to said conductor track andkept spaced apart from said transparent substrate; and an opaque lightblocking element, disposed between said substrate and said chip, thatshields said sensor from lateral light opposite the emitter.
 23. Theoptoelectronic module of claim 22, wherein said light blocking elementcomprises an elastic conformable material, which conforms to said chipand adapts to the spacing between said chip and said substrate.
 24. Theoptoelectronic module of claim 22, wherein said light blocking elementcomprises an elastic conformable material, which conforms to saidtransparent substrate and adapts to the spacing between said chip andsaid substrate.
 25. The optoelectronic module of claim 22, wherein saidlight blocking element is solidly joined to said chip.
 26. Theoptoelectronic module of claim 22, wherein said light blocking elementis solidly joined to said transparent substrate.
 27. The optoelectronicmodule of claim 22, wherein said light blocking element comprisesinjection-moldable which is applied to said chip.
 28. The optoelectronicmodule of claim 22, wherein said light blocking element comprisesinjection-moldable which is applied to said substrate.
 29. Theoptoelectronic module of claim 22, wherein said light blocking elementcomprises printable material which is applied to said chip.
 30. Theoptoelectronic module of claim 22, wherein said light blocking elementcomprises print able material which is applied to said substrate. 31.The optoelectronic module of claim 22, wherein said sensor and saidemitter are disposed on or in said chip, and said light blocking elementis disposed between said sensor and said emitter.
 32. The optoelectronicmodule of claim 22, wherein said sensor and a second sensor aredistributed about said emitter.
 33. The optoelectronic module of claim22, wherein said light blocking element surrounds said emitter.
 34. Theoptoelectronic module of claim 33, wherein said light blocking elementis embodied in circular-annular form.
 35. The optoelectronic module ofclaim 22, wherein a bonding wire of said emitter is passed through saidlight blocking element.
 36. The optoelectronic module of claim 22,further comprising an underfiller that is disposed in an intermediatespace between said chip and said transparent substrate.
 37. Theoptoelectronic module of claim 36, wherein said underfiller is disposedon only one side of said light blocking element.
 38. The optoelectronicmodule of claim 37, wherein a space, blocked off by said light blockingelement, around said emitter is free of underfiller.
 39. Theoptoelectronic module of claim 22, wherein said light blocking elementcomprises a first rib of said chip and a second rib of said substrate,wherein said first and second ribs are disposed offset from one anotherand overlap in height.
 40. The optoelectronic module of claim 22,wherein said light blocking element comprises only one rib, and said ribengages an indentation of said substrate.
 41. The optoelectronic moduleof claim 22, wherein said light blocking element comprises only one rib,and said rib engages an indentation of said chip.
 42. The optoelectronicmodule of claim 22, wherein said transparent substrate comprises aplurality of opaque and transparent regions disposed in alternation,which form a scanning grating for cooperation with a measurementgraduation of a scale of a position measuring system.
 43. A positionmeasuring system comprising; a scale comprising a measurementgraduation; and an optoelectronic module, comprising: a transparentsubstrate that carries a conductor track; an optoelectronic chipcomprising an optoelectronic sensor disposed on said substrate, and viaa contacting element said chip is connected to said conductor track andkept spaced apart from said transparent substrate; and an opaque lightblocking element, disposed between said substrate and said chip, thatshields said sensor from lateral incident light.
 44. The positionmeasuring system of claim 43, wherein said light blocking elementcomprises an elastic conformable material, which conforms to said chipand adapts to the spacing between said chip and said substrate.
 45. Theposition measuring system of claim 43, wherein said light blockingelement comprises printable material which is applied to said chip. 46.The position measuring system of claim 43, further comprising an emitterfor light.
 47. The position measuring system of claim 46, wherein saidsensor and said emitter are disposed on or in said chip, and said lightblocking element is disposed between said sensor and said emitter. 48.The position measuring system of claim 43, wherein said light blockingelement surrounds said sensor.
 49. The position measuring system ofclaim 48, wherein said light blocking element is embodied incircular-annular form.
 50. The position measuring system of claim 43,further comprising an underfiller that is disposed in an intermediatespace between said chip and said transparent substrate.
 51. The positionmeasuring system of claim 50, wherein said underfiller is disposed ononly one side of said light blocking element.
 52. The position measuringsystem of claim 43, wherein said light blocking element comprises afirst rib of said chip and a second rib of said substrate, wherein saidfirst and second ribs are disposed offset from one another and overlapin height.
 53. The position measuring system of claim 43, wherein saidlight blocking element comprises only one rib.
 54. The positionmeasuring system of claim 43, wherein said transparent substratecomprises a plurality of opaque and transparent regions disposed inalternation, which form a scanning grating.
 55. A position measuringsystem, comprising: a scale comprising a measurement graduation; and anoptoelectronic module, comprising: a transparent substrate that carriesa conductor track; an optoelectronic chip comprising a sensor and anemitter for light disposed on said substrate, and via a contactingelement said chip is connected to said conductor track and kept spacedapart from said transparent substrate; and an opaque light blockingelement, disposed between said substrate and said chip, that shieldssaid sensor from lateral light opposite said emitter.
 56. The positionmeasuring system of claim 55, wherein said light blocking elementcomprises an elastic conformable material, which conforms to said chipand adapts to the spacing between said chip and said substrate.
 57. Theposition measuring system of claim 55, wherein said light blockingelement comprises printable material which is applied to said chip. 58.The position measuring system of claim 55, wherein said sensor and saidemitter are disposed on or in said chip, and said light blocking elementis disposed between said sensor and said emitter.
 59. The positionmeasuring system of claim 55, wherein said light blocking elementsurrounds said emitter.
 60. The position measuring system of claim 59,wherein said light blocking element is embodied in circular-annularform.
 61. The position measuring system of claim 55, further comprisingan underfiller that is disposed in an intermediate space between saidchip and said transparent substrate.
 62. The position measuring systemof claim 61, wherein said underfiller is disposed on only one side ofsaid light blocking element.
 63. The position measuring system of claim62, wherein a space, blocked off by said light blocking element, aroundsaid emitter is free of underfiller.
 64. The position measuring systemof claim 55, wherein said light blocking element comprises a first ribof said chip and a second rib of said substrate, wherein said first andsecond ribs are disposed offset from one another and overlap in height.65. The position measuring system of claim 55, wherein said lightblocking element comprises only one rib.
 66. The position measuringsystem of claim 55, wherein said transparent substrate comprises aplurality of opaque and transparent regions disposed in alternation,which form a scanning grating.